DocumentCode
1935182
Title
Is There Anything Beyond the 64 MDRAM
Author
Shibayama, Kyoichi
Author_Institution
LSI R&D Lab., Mitsubishi Electric Corp., Mizuhara, Itami 664 JAPAN; Ryouden Kasei Company, 2-6-1 Miwa, Sanda, 669-13 JAPAN
fYear
1989
fDate
11-14 Sept. 1989
Firstpage
861
Lastpage
870
Abstract
Physical and economical constraints which provides obstacles for the improvement of VLSI technology beyond 64MDRAM or O. 3um, and the approach and physically new device concepts how to prevent these issues are discussed quantitatively as far as possible. Fundamentally, a MOS transistor can work at 0. 1um gate length probably on the chip level with IV power supply at 77K. SOI structure or precisely controlled channel engineering under the low temperature heat cycle is essentially important. New materials or new device concepts are substantially needed for a DRAM cell in future. Other physically new concepts or attempt which provides larger operational margin or better performance of a miniaturized device will also be discussed.
Keywords
Cryogenics; Electronics industry; Hot carriers; Image resolution; Impurities; Low voltage; MOSFETs; Mass production; Random access memory; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location
Berlin, Germany
Print_ISBN
0387510001
Type
conf
Filename
5436467
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