The Novel Type Of Conductive Paste Using Functionally Gradient Ag-cu Powder

Author

Hori, T. ; Otani, A. ; Ogura, Y. ; Naliamura, M. ; Matsuda, H. ; Sato, J.

fYear

1997

fDate

16-18 April 1997

Firstpage

337

Lastpage

341

Keywords

Circuit testing; Conductivity; Copper; Oxidation; Polymer films; Powders; Printed circuits; Printing; Surface resistance; Thick films;

fLanguage

English

Publisher

ieee

Conference_Titel

IEMT/IMC Symposium, 1997., 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference]

Conference_Location

IEEE

Print_ISBN

0-7803-4235-6

Type

Filename

619033

Link To Document