DocumentCode :
1935519
Title :
Optimization and experimental validation of electrostatic adhesive geometry
Author :
Ruffatto, D. ; Shah, J. ; Spenko, M.
Author_Institution :
MMAE Dept., Illinois Inst. of Technol., Chicago, IL, USA
fYear :
2013
fDate :
2-9 March 2013
Firstpage :
1
Lastpage :
8
Abstract :
This paper introduces a method to optimize the electrode geometry of electrostatic adhesives for robotic gripping, attachment, and manipulation applications. Electrostatic adhesion is achieved by applying a high voltage potential, on the order of kV, to a set of electrodes, which generates an electric field. The electric field polarizes the substrate material and creates an adhesion force. Previous attempts at creating electro-static adhesives have shown them to be effective, but researchers have made no effort to optimize the electrode configuration and geometry. We have shown that by optimizing the geometry of the electrode configuration, the electric field strength, and therefore the adhesion force, is enhanced. To accomplish this, Comsol Multiphysics was utilized to evaluate the average electric field generated by a given electrode geometry. Several electrode patterns were evaluated, including parallel conductors, concentric circles, Hilbert curves (a fractal geometry) and spirals. The arrangement of the electrodes in concentric circles with varying electrode widths proved to be the most effective. The most effective sizing was to use the smallest gap spacing allowable coupled with a variable electrode width. These results were experimentally validated on several different surfaces including drywall, wood, tile, glass, and steel. A new manufacturing process allowing for the fabrication of thin, conformal electro-static adhesive pads was utilized. By combining the optimized electrode geometry with the new fabrication process we are able to demonstrate a marked improvement of up to 500% in shear pressure when compared to previously published values.
Keywords :
adhesives; electric fields; electrodes; electrostatic devices; geometry; grippers; manipulators; shear strength; Hilbert curves; adhesion force; concentric circles; drywall; electric field strength; electrode configuration; electrostatic adhesive geometry; experimental validation; fabrication process; glass; high voltage potential; manipulation applications; optimization; parallel conductors; robotic gripping; shear pressure; spirals; steel; substrate material; tile; variable electrode width; wood; Dielectrics; Electric potential; Electrodes; Optimization; Spirals; Substrates; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Aerospace Conference, 2013 IEEE
Conference_Location :
Big Sky, MT
ISSN :
1095-323X
Print_ISBN :
978-1-4673-1812-9
Type :
conf
DOI :
10.1109/AERO.2013.6496943
Filename :
6496943
Link To Document :
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