• DocumentCode
    1935653
  • Title

    High K gate dielectrics for the silicon industry

  • Author

    Manchanda, L. ; Busch, B. ; Green, M.L. ; Morris, Milton ; van Dover, R.B. ; Kwo, R. ; Aravamudhan, S.

  • Author_Institution
    Agere Syst., Murray Hill, NJ, USA
  • fYear
    2001
  • fDate
    1-2 Nov. 2001
  • Firstpage
    56
  • Lastpage
    60
  • Abstract
    The exponential growth of the silicon industry can be attributed to that fact that silicon has a native oxide that is silicon dioxide. With SiO/sub 2/ soon approaching fundamental limit, we must find an alternate to SiO/sub 2/ or a new switch to replace MOSFET. In this paper we focus on leading alternate gate dielectrics. We first discuss the selection criteria for alternate gate dielectrics and why it is important to have an amorphous gate dielectric. SiO/sub 2/ and aluminum oxide remain amorphous at very high temperatures. For dielectrics with K > 15 and gate power < 100mW/cm/sup 2/, it may be necessary to stabilize the amorphous phase of metal oxides by adding Al or Si into the oxide; and thus forming multi-component dielectrics such as aluminates or silicates. At present, the most critical issue facing the high K research is the reduced mobility and therefore the effective fixed charge at the dielectric/Si interface. In this paper, we also shed some light on the effective fixed charge in group-three metal oxides.
  • Keywords
    MOSFET; carrier mobility; dielectric thin films; elemental semiconductors; silicon; MOSFET; Si; aluminate; aluminum oxide; amorphous gate dielectric; carrier mobility; dielectric/Si interface; fixed charge; high-K gate dielectric; metal oxide; multi-component oxide; silicate; silicon industry; Aluminum oxide; Amorphous materials; CMOS technology; Dielectric devices; Electric breakdown; High K dielectric materials; High-K gate dielectrics; Silicon compounds; Switches; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gate Insulator, 2001. IWGI 2001. Extended Abstracts of International Workshop on
  • Conference_Location
    Tokyo, Japan
  • Print_ISBN
    4-89114-021-6
  • Type

    conf

  • DOI
    10.1109/IWGI.2001.967545
  • Filename
    967545