DocumentCode :
1936019
Title :
In-situ ESR observation of dangling bond formation during very thin amorphous SiO2 growth on Si
Author :
Futako, W. ; Nishizawa, M. ; Yasuda, T. ; Isoya, J. ; Yamasaki, S.
Author_Institution :
Angstrom Technol. Partenership, Joint Res. Center for Atom Technol., Tsukuba, Japan
fYear :
2001
fDate :
1-2 Nov. 2001
Firstpage :
130
Lastpage :
131
Abstract :
The processes of formation of the interface dangling bond (P/sub b/ centers) during amorphous SiO/sub 2/ thin-film growth, by oxidation, on a clean Si[111] substrate was performed. Within 0.4 nm of the oxide layer, the number of P/sub b/ centers rapidly reached the same order of magnitude as that in thick a-SiO/sub 2/ films. These results indicate that the interface defects between Si and a-SiO/sub 2/ originate mainly from the short-range chemical bonding configurations, not from the long-range accumulation of structural misfits between the two materials.
Keywords :
dangling bonds; dielectric thin films; elemental semiconductors; interface structure; oxidation; paramagnetic resonance; silicon; silicon compounds; 0.4 nm; Si; Si-SiO/sub 2/; amorphous SiO/sub 2/ thin-film growth; dangling bond formation; in-situ ESR observation; interface dangling bond; interface defects; oxidation; short-range chemical bonding configurations; Amorphous materials; Atomic layer deposition; Bonding; Oxidation; Paramagnetic resonance; Silicon; Spectroscopy; Surface cleaning; Temperature; Vacuum systems;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Gate Insulator, 2001. IWGI 2001. Extended Abstracts of International Workshop on
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-021-6
Type :
conf
DOI :
10.1109/IWGI.2001.967563
Filename :
967563
Link To Document :
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