Title :
Packaging of silicon pressure sensors for home appliances
Author :
Ampabadal, F. ; Carreras, Lluís ; Arrieta, María Jesús
Author_Institution :
Centre Nacional de Microelectron., CSIC, Barcelona, Spain
Abstract :
In this paper a packaging technology proposal for piezoresistive pressure sensors is presented which is mainly characterized by its low cost. Assembly of the pressure device is made by direct adhesion of the silicon die on standard PCB and protection against aggressive media is obtained by using thermally cured silicone gel. Characterization of the packaged sensors has shown that when using a suitable signal-conditioning circuitry the sensor microsystem performance is adequate for its use in home appliances.
Keywords :
elemental semiconductors; microsensors; packaging; piezoresistive devices; pressure sensors; Si; home appliances; packaging technology; piezoresistive pressure sensors; pressure device; sensor microsystem performance; silicon die; silicon pressure sensors; silicone gel; Adhesives; Assembly; Costs; Home appliances; Packaging; Piezoresistance; Proposals; Protection; Sensor phenomena and characterization; Silicon;
Conference_Titel :
Electron Devices, 2005 Spanish Conference on
Conference_Location :
Tarragona
Print_ISBN :
0-7803-8810-0
DOI :
10.1109/SCED.2005.1504524
