DocumentCode :
1936209
Title :
Latch-up Free CMOS Using Buried Polysilicon Diodes
Author :
Reczek, W. ; Winner, J. ; Bonner, F. ; Murphy, Bernadette
Author_Institution :
Siemens AG, Components Group, Otto-Hahn-Ring 6, D-8000 Munich 83, FRG
fYear :
1989
fDate :
11-14 Sept. 1989
Firstpage :
679
Lastpage :
682
Abstract :
Latch-up free CMOS circuit operation is achieved through the use of buried polysilicon diodes instead of conventional (ohmic) well contacts. In a DRAM technolgy with polysilicon bit line a buried polysilicon diode can be realized with no additional process step and no additional die area is required. No degradition of MOS device parameters occurs. The basis for experiment is a 4M DRAM 0.9¿m n-well CMOS technology with substrate bias generator [1].
Keywords :
CMOS process; CMOS technology; Character generation; Circuits; DC generators; Diodes; Latches; MOS devices; Power generation; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location :
Berlin, Germany
Print_ISBN :
0387510001
Type :
conf
Filename :
5436510
Link To Document :
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