DocumentCode :
1936245
Title :
MES system solution for PLAT recipe reduction
Author :
Mai, Karen ; Chang, Joseph ; Huang, Jeff ; Jann, Larry ; Lo, Justin ; Lan, J.K.
Author_Institution :
Integration Dev. Dept., Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
fYear :
2012
fDate :
4-4 Sept. 2012
Firstpage :
1
Lastpage :
2
Abstract :
For recipe reduction requirement of bump plating process, we provided the MES system solutions - recipe parameters, product table and conversion function in SiView SpecMgr. Recipe parameter could help to define different process conditions by specific product instead of recipe itself. Product table is to maintain recipe parameter directly in product table instead of recipe table and the concept is easy and straightforward for users to maintain. Conversion function used in recipe parameter could help to get real value from product table. Thus, PLAT recipe became to only define plating current, but the process time actually defined in product table by each specific product. So PLAT recipes could be grouping and reduced to extremely small counts compare to as-was. All functions were already existed in SiView SpecMgr and helped to minimize the IT development effort. After all, it´s a creative idea without experience in any other process before but did contribute the most important part for PLAT recipe reduction.
Keywords :
electroplating; manufacturing systems; production engineering computing; MES system solution; PLAT recipe reduction; SiView SpecMgr; bump plating process; conversion function; manufacturing execution system; plating current; product table; recipe parameter; recipe reduction requirement; Abstracts; Collaboration; Companies; Facsimile; Maintenance engineering; Manufacturing; Routing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
e-Manufacturing & Design Collaboration Symposium (eMDC), 2012
Conference_Location :
HsinChu
Print_ISBN :
978-1-4673-4540-8
Type :
conf
DOI :
10.1109/eMDC.2012.6338426
Filename :
6338426
Link To Document :
بازگشت