Title :
AlSi/Ti/AlSi Multisandwich Systems on TiN/Ti for VLSI Interconnect Applications
Author :
Roska, G. ; Kucher, P. ; Vollmer, B. ; Oppolzer, H. ; Zorn, G. ; Cichy, H.
Author_Institution :
Siemens AG, Semiconductor Division, Otto-Hahn-Ring 6, D-8000 Mÿnchen 83, F.R.G.
Abstract :
The influence of the Ti thickness of the AlSi/Ti/AlSi system on Ti/TiN was investigated by transmission electron microscopy (TEM), x-ray diffraction measurements, scanning electron microscopy (SEM) and energy dispersive x-ray analysis (EDX). The results are discussed and correlated to the data of accelerated electromigration stress tests.
Keywords :
Dispersion; Electromigration; Energy measurement; Life estimation; Scanning electron microscopy; Thickness measurement; Tin; Transmission electron microscopy; Very large scale integration; X-ray diffraction;
Conference_Titel :
Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
Conference_Location :
Berlin, Germany
