• DocumentCode
    1936469
  • Title

    Miniaturized Accelerometers Based on Silicon Micromachining Techniques

  • Author

    Benecke, W. ; Riethmuller, W. ; Schnakenberg, U. ; Wagner, B.

  • Author_Institution
    Fraunhofer-Institut fÿr Mikrostrukturtechnik, Dillenburger Str. 53, D-1000 Berlin 33, Federal Republic of Germany
  • fYear
    1989
  • fDate
    11-14 Sept. 1989
  • Firstpage
    627
  • Lastpage
    630
  • Abstract
    A miniaturized acceleration sensor has been fabricated using silicon micromachining techniques. Integrated monocrystalline silicon piezoresistors are used to detect the bending of a beam attached to a seismic mass. An outline is presented for improvement of the sensor performance with respect to temperature sensitivity and overrange protection.
  • Keywords
    Accelerometers; Capacitive sensors; Etching; Micromachining; Particle beams; Piezoresistive devices; Sensor systems and applications; Silicon; Structural beams; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1989. ESSDERC '89. 19th European
  • Conference_Location
    Berlin, Germany
  • Print_ISBN
    0387510001
  • Type

    conf

  • Filename
    5436522
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1936469