Micro bridge technology, a better solution for 3D-IC interconnection

Summary form only given. We all know that the cloud computing era is becoming more reality now-a-days. To handle the data information down loaded from the cloud computing we need a smart terminal to manipulate these down loaded data to meet your local need either private or business sectors. The 3D-Computer based on the 3D-IC design architecture maybe the best choice for this purpose. This 3D-Computer will not only meet the challenge of cloud computing but also meet the global warming regulation pertaining to the less carbon consumption and energy saving criterion. The main technologies for integration and manufacturing the 3D-Computer are (1) through silicon via (TSV) technology for vertical communication; (2) interconnecting technology to accomplish the up and down signal message transferable between wafer layers and (3) stacking technology to complete the final assembly of the 3D-Computer system. There is one thing very important in the integration and manufacturing process which is the testing and evaluating of the 3D-IC stacked system. This paper will dedicate to the issue of choosing the right interconnecting technology for cost effective consideration by introducing the micro bridge technology. With the right choice of interconnecting technology will benefit to the reduction of the 3D-IC and 3D-Computer testing both in cost and complexity.