DocumentCode
1936714
Title
Understanding of hard and soft breakdown phenomena in thin gate oxides through carrier transport properties after breakdown
Author
Takagi, S. ; Takayanagi, M.
Author_Institution
Adv. LSI Technol. Lab., Toshiba Corp., Kawasaki, Japan
fYear
2001
fDate
1-2 Nov. 2001
Firstpage
216
Lastpage
219
Abstract
The carrier separation technique is applied to gate oxides after the occurrence of soft and hard breakdown. The dominant carrier type in leakage current flow through gate oxides after breakdown is identified for MOSFETs with different channel types and doping types of the poly Si gate electrode. The systematic approach through this combination of carrier separation measurement and MOSFETs with various doping types is shown to be quite effective in studying the conduction mechanism and the physical picture of breakdown spots.
Keywords
MOSFET; leakage currents; semiconductor device breakdown; semiconductor device measurement; silicon; MOSFET; breakdown; carrier separation technique; carrier transport properties; conduction mechanism; hard breakdown phenomena; leakage current flow; poly Si gate electrode doping; soft breakdown phenomena; thin gate oxides; Charge carrier processes; Current measurement; Doping; Electric breakdown; Electrodes; Impact ionization; Leakage current; MOSFETs; Substrate hot electron injection; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Gate Insulator, 2001. IWGI 2001. Extended Abstracts of International Workshop on
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-021-6
Type
conf
DOI
10.1109/IWGI.2001.967587
Filename
967587
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