Title :
IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565)
Abstract :
The 10th Topical Meeting on Electrical Performance of Electronic Packaging provides a forum for the presentation and discussion of the latest advances in electrical design, analysis and characterization of on-chip and package interconnections and structures for digital, mixed signal, RF, microwave and mm-wave applications. The following topics are dealt with: server systems; RF/microwave; transmission line modeling; power distribution; EM modeling; model order reduction; power decoupling; system design, measurement and modeling; low power issues
Keywords :
design engineering; digital circuits; electromagnetic fields; integrated circuit interconnections; integrated circuit packaging; low-power electronics; microwave circuits; millimetre wave circuits; mixed analogue-digital integrated circuits; power supply circuits; printed circuits; transmission line theory; EM modeling; RF applications; digital applications; electrical analysis; electrical characterization; electrical design; electrical performance; electronic packaging; low power issues; microwave applications; mixed signal applications; mm-wave applications; model order reduction; on-chip interconnections; package interconnections; power decoupling; power distribution; server systems; system design; system measurement; system modeling; transmission line modeling;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA, USA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967597
