DocumentCode :
1937144
Title :
Time-domain scattering method using triangle impulse responses for modeling electronic packaging components
Author :
Chen, Zhaoqing ; Ruehli, Albert
Author_Institution :
Enterprise Syst. Group, IBM Corp., Poughkeepsie, NY, USA
fYear :
2001
fDate :
2001
Firstpage :
51
Lastpage :
54
Abstract :
This paper describes a time-domain scattering method using triangle impulse response for modeling electronic packaging components such as connectors and vias. The method provides a direct data interface for linear component models to time-domain EM/circuit simulation tools
Keywords :
packaging; time-domain analysis; transient response; EM simulation; circuit simulation; connector; data interface; electronic packaging; linear component model; time-domain scattering method; triangle impulse response; via; Circuit simulation; Connectors; Electronics packaging; Impedance; Power system modeling; SPICE; Scattering parameters; Time domain analysis; Transmission line discontinuities; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
Type :
conf
DOI :
10.1109/EPEP.2001.967609
Filename :
967609
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1937144
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