Characterization of via-induced parallel-plate resonances in a printed circuit board

Author

Iwanami, M. ; Hoshino, S.

Author_Institution

Assoc. of Super-Advanced Electron. Technol., Tsukuba, Japan

fYear

2001

fDate

2001

Firstpage

65

Lastpage

68

Abstract

This paper describes the fundamental characteristics of parallel-plate resonances which are induced by the via penetrating a parallel-plate in a multilayer printed circuit board (PCB). From the results of experiments and simulations, the origin of the strong resonance peak in the |S₂₁| characteristic is discussed. It is shown that the strong resonance peak may result from the correspondence between the parallel resonance frequencies in the input impedance of the parallel-plate and in that of the signal trace with the exception of the via

Keywords

S-parameters; circuit resonance; circuit simulation; laminates; packaging; printed circuit testing; S₂₁ characteristic; multilayer PCB; multilayer printed circuit board; parallel resonance frequencies; parallel-plate input impedance; parallel-plate resonances; parallel-plate via penetration; printed circuit board; resonance peak; signal trace input impedance; simulations; via-induced parallel-plate resonances; Dielectrics; Fabrication; Impedance; Large scale integration; Nonhomogeneous media; Printed circuits; Resonance; Resonant frequency; Signal design; Stacking;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2001

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-7024-4

Type

conf

DOI

10.1109/EPEP.2001.967612

Filename

967612