Title :
The use of loop inductances in signal integrity modeling
Author_Institution :
Compaq Comput. Corp., Marlborough, MA, USA
Abstract :
For many years, partial inductances have been used in circuit models for signal integrity. However, the author´s experience has indicated that partial inductances have more drawbacks than benefits for such work. This paper describes these drawbacks, and proposes a different method of including inductive effects in signal integrity modeling, based on loop inductances. A discussion of the theory and an example are given
Keywords :
SPICE; circuit simulation; inductance; SPICE; circuit models; inductive effects; loop inductances; signal integrity modeling; simulation; Circuit theory; Coils; Connectors; Inductance; Inductors; Magnetic flux; Magnetic properties; Packaging; SPICE; Wire;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967616