Robust, reworkable thermal electronic packaging: Applications in high power TR modules for space

Several promising technologies and techniques for high power (>100W) TR module packaging have been incorporated into the baseline design of the TR modules for the proposed DESDynI SAR Instrument. A few advanced technologies, which have not been incorporated into the baseline design, including the PCM thermal capacitor and the CE alloys, have been integrated into an advanced module, in order to compare the thermal performance of the baseline flight design to the advanced packaging design. Successful integration of these technologies being investigated as part of the NASA Advanced Component Technology task, allows for packaging of higher power density electronics, while maintaining reliability and stability. This work helps to enable more cost effective radar architectures for earth remote sensing, such as SweepSAR, which is an architecture being considered for the proposed DESDynI radar instrument. This paper will detail the final tests, compare the results of this three-year task and include studies on the individual technologies, which can be scaled to work with other design requirements, such as direct die attachment to thermally stable carriers for high-frequency instruments.