Title :
Yield analysis and optimization of VLSI interconnects in multichip modules
Author :
Zhang, Q.J. ; Nakhla, Michel
Author_Institution :
Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
Abstract :
A CAD approach integrating multidimensional correlated Monte-Carlo analysis and generalized l1 optimization with lossy transmission line network simulations is presented. It is implemented in a CAD framework for statistical analysis and yield optimization of high-speed VLSI interconnects. Physical/geometrical based hierarchical Monte-Carlo analysis and yield optimization examples are presented
Keywords :
Monte Carlo methods; VLSI; circuit layout CAD; integrated circuit technology; multichip modules; statistical analysis; transmission line theory; CAD approach; asymptotic waveform evaluation; hierarchical Monte-Carlo analysis; high-speed VLSI interconnects; lossy transmission line network simulations; multichip modules; multidimensional correlated Monte-Carlo analysis; statistical analysis; yield optimization; Analytical models; Design automation; Integrated circuit interconnections; Manufacturing processes; Material properties; Multichip modules; Multidimensional systems; Propagation losses; Transmission lines; Very large scale integration;
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-3540-1
DOI :
10.1109/MCMC.1993.302134
