Design and verification of differential transmission lines

Author

Wu, Henry ; Beyene, Wendemagegnehu T. ; Cheng, Newton ; Huang, Ching-Chao ; Yuan, Chuck

Author_Institution

Rambus Inc., Los Altos, CA, USA

fYear

2001

fDate

2001

Firstpage

85

Lastpage

88

Abstract

Differential signaling is a popular choice for multi-gigabit digital applications such as FiberChannel, Infiniband, OIF, RapidIO, and XAUI. This is due to the fact that differential signaling has the ability to reject common mode noise such as cross talk, simultaneous switching noise, power supply and ground bounce noise. To support differential signaling, differential transmission lines are required. There are several ways of designing differential transmission lines on a conventional printed circuit board (PCB). These include microstrip line, edge coupled stripline, and broadside-coupled stripline. This paper describes a methodology for designing and verifying differential transmission lines on PCBs. The electrical performance of these three differential transmission lines is evaluated in both the frequency and time domain. The practical consideration of manufacturing variation is also examined. Finally, accurate HSPICE w-element models are generated for time domain transient simulations

Keywords

S-parameters; SPICE; circuit noise; circuit simulation; crosstalk; frequency-domain analysis; printed circuit design; strip lines; time-domain analysis; HSPICE; broadside-coupled stripline; common mode noise; crosstalk; differential signaling; differential transmission lines; edge coupled stripline; frequency domain; ground bounce noise; microstrip line; multi-gigabit digital applications; power supply; printed circuit board; simultaneous switching noise; time domain; transient simulations; w-element models; Circuit noise; Coupling circuits; Design methodology; Distributed parameter circuits; Microstrip; Power supplies; Power transmission lines; Printed circuits; Stripline; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2001

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-7024-4

Type

conf

DOI

10.1109/EPEP.2001.967617

Filename

967617