Integrated RF function architectures in fully-organic SOP technology

Author

Davis, M.F. ; Sutono, A. ; Obatoyinbo, A. ; Chakraborty, S. ; Lim, K. ; Pinel, S. ; Laskar, J. ; Lee, S. ; Tummala, R.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2001

fDate

2001

Firstpage

93

Lastpage

96

Abstract

Presents the design, and measurement of RF-microwave multilayer interconnects and integrated passives implemented in a fully-organic system on package(SOP) technology. A CPW-microstrip interconnect scheme demonstrates a measured insertion loss of 1.7 dB at 12 GHz and a return loss better than 20 dB to 12 GHz. The novel hollow ground plane inductor configuration exhibits Q and effective inductance(Leff) enhancement by a factor of 2.5 and 2, respectively with SRF to 14 GHz. In addition, compact filters have also been designed for Optical Sub-Carrier Multiplexing(OSCM) link applications. These developments suggest the feasibility of building highly integrated organic-based radio front-end SOP

Keywords

Q-factor; coplanar waveguides; inductors; interconnections; laminates; microstrip lines; microstrip transitions; packaging; subcarrier multiplexing; wiring; 1.7 dB; 12 GHz; 14 GHz; 20 dB; CPW-microstrip interconnect scheme; Q; RF-microwave multi-layer interconnects; SRF; effective inductance; fully-organic SOP technology; hollow ground plane inductor configuration; insertion loss; integrated RF function architectures; integrated passives; optical sub-carrier multiplexing; organic-based radio front-end SOP; return loss; system on package technology; Buildings; Inductors; Insertion loss; Loss measurement; Nonhomogeneous media; Optical design; Optical filters; Optical losses; Packaging; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2001

Conference_Location

Cambridge, MA

Print_ISBN

0-7803-7024-4

Type

conf

DOI

10.1109/EPEP.2001.967619

Filename

967619