DocumentCode :
1937408
Title :
Wave spreading evaluation of interconnect systems
Author :
Liao, Haifang ; Dai, Wayne Wei-Ming
Author_Institution :
Board of Studies in Comput. Eng., California Univ., Santa Cruz, CA, USA
fYear :
1993
fDate :
15-18 Mar 1993
Firstpage :
128
Lastpage :
133
Abstract :
General multiport interconnect constraints are derived and the wave spreading evaluation (WSE) approach, which uses S-parameter based network techniques to analyze coupled, multiconductor interconnect systems for high-speed analog and digital integrated circuits, is presented. WSE is based on the spreading process of voltage waves with initial spreading waves created by the initial sources. The spreading process is independent of input sources, and every step of wave spreading meets the constraints of KCL and KVL. The continual spreading of voltage waves creates accurate results. The convergence condition is always met for passive networks
Keywords :
S-parameters; SPICE; circuit analysis computing; metallisation; multichip modules; multiport networks; printed circuit accessories; transmission line theory; waveform analysis; KCL; KVL; MCM; PCB; S-parameter based network techniques; SPICE; WSE method; digital integrated circuits; general multiport interconnect constraints; high speed analogue integrated circuits; lossless transmission line network; multiconductor interconnect systems; passive networks; voltage wave spreading; wave spreading evaluation approach; Coupling circuits; Distributed parameter circuits; Frequency; Integrated circuit interconnections; Multiconductor transmission lines; Performance analysis; Scattering parameters; Sparse matrices; Transmission line matrix methods; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-3540-1
Type :
conf
DOI :
10.1109/MCMC.1993.302139
Filename :
302139
Link To Document :
بازگشت