Reliability by design for MCM manufacturing the roadmap and an example

Author

Shen, Nien-Tsu ; Yang, Jimmy

Author_Institution

MicroModule Systems Inc., Cupertino, CA, USA

fYear

1993

fDate

15-18 Mar 1993

Firstpage

100

Lastpage

105

Abstract

Reliability by design for high-density thin-film multichip module (MCM) manufacturing is discussed. The roadmap and examples are based upon the experience and knowledge obtained from the Digital VAX9000 mainframe MCU technology through all phases of the program. Current successful development of a low power R3000 RISC MCM design application for desktop workstations which utilizes the concurrent engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe is also reviewed

Keywords

circuit CAD; circuit reliability; concurrent engineering; integrated circuit manufacture; multichip modules; reduced instruction set computing; CAD; CPU system performance; Digital VAX9000 mainframe MCU technology; MCM manufacturing; concurrent engineering approach; desktop workstations; high-density thin-film multichip module; low power R3000 RISC MCM design; reliability by design; Costs; Design engineering; Manufacturing; Materials reliability; Multichip modules; Power engineering and energy; Power system reliability; Product design; Reliability engineering; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE

Conference_Location

Santa Cruz, CA

Print_ISBN

0-8186-3540-1

Type

conf

DOI

10.1109/MCMC.1993.302144

Filename

302144