Title :
Reliability by design for MCM manufacturing the roadmap and an example
Author :
Shen, Nien-Tsu ; Yang, Jimmy
Author_Institution :
MicroModule Systems Inc., Cupertino, CA, USA
Abstract :
Reliability by design for high-density thin-film multichip module (MCM) manufacturing is discussed. The roadmap and examples are based upon the experience and knowledge obtained from the Digital VAX9000 mainframe MCU technology through all phases of the program. Current successful development of a low power R3000 RISC MCM design application for desktop workstations which utilizes the concurrent engineering approach to achieve higher CPU system performance at a reasonable cost and timeframe is also reviewed
Keywords :
circuit CAD; circuit reliability; concurrent engineering; integrated circuit manufacture; multichip modules; reduced instruction set computing; CAD; CPU system performance; Digital VAX9000 mainframe MCU technology; MCM manufacturing; concurrent engineering approach; desktop workstations; high-density thin-film multichip module; low power R3000 RISC MCM design; reliability by design; Costs; Design engineering; Manufacturing; Materials reliability; Multichip modules; Power engineering and energy; Power system reliability; Product design; Reliability engineering; Testing;
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-3540-1
DOI :
10.1109/MCMC.1993.302144
