Title :
A broad band Through-Line-Line de-embedding technique for BGA package measurements
Author :
Liang, Hongwei ; Laskar, Joy ; Hyslop, Mike
Author_Institution :
Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
In this paper, a broad band Through-Line-Line (TLL) de-embedding technique is presented for accurate measurement and characterization of millimeter-wave devices. It is especially useful when the adapter or the launch is over one-quarter wavelength for which the traditional adapter-removal calibration is not applicable. The algorithm and the implementation of the TLL components are explained in detail. The applicability of the TLL technique has been demonstrated from DC to 50 GHz by an application to the de-embedding of a millimeter-wave BGA package measurement
Keywords :
ball grid arrays; millimetre wave measurement; 0 to 50 GHz; BGA package measurement; adapter; broadband Through-Line-Line de-embedding algorithm; launch; milllimeter-wave device; Calibration; Frequency; Microwave devices; Millimeter wave measurements; Packaging; Probes; Scattering parameters; Testing; Transmission line measurements; Wavelength measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967627
