Title :
A de-embedding technique for interconnects
Author :
Song, Jiming ; Ling, Feng ; Flynn, Greg ; Blood, William ; Demircan, Ertugrul
Author_Institution :
Motorola Inc., Tempe, AZ, USA
Abstract :
In general, three parameters are needed to model symmetrical adapters, but not enough equations can be found to solve them. The measurement of through adapters gives two conditions only, but neither open nor short adapter gives any useful condition. The results from lines with length L and length 2L can be used to derive the result for through adapters. This paper proposes one approach with a 2-impedance model, which has one shunt impedance and one series impedance. This model can be used with more complicated structures than the single impedance model
Keywords :
electric impedance; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; de-embedding technique; interconnect measurement; series impedance; shunt impedance; symmetrical adapter; two-impedance model; Blood; Circuit testing; Equations; Frequency measurement; Gain measurement; Impedance; Integrated circuit interconnections; Symmetric matrices; Transmission line matrix methods; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967628