DocumentCode :
1937664
Title :
Developing a merchant MCM infrastructure
Author :
Naclerio, Nicholas J.
Author_Institution :
Defense Adv. Res. Proj. Agency Arlington, VA, USA
fYear :
1993
fDate :
15-18 Mar 1993
Firstpage :
45
Abstract :
Summary form only given. Despite demand for higher performance, miniaturization, and more cost-effective subsystem packaging, potential users of MCM technology have been frustrated by long lead times, high costs, and perceived risks of depending upon an unproven supplier infrastructure. In order to address these issues, the application specific electronic module (ASEM) program has been established. The goal of that effect is to help create a viable domestic supplier infrastructure which can serve the needs of both military and commercial customers. The model for the ASEM concept is the merchant ASIC business. Goals for turn-around time, cost, and quality would be similar to what ASIC vendors offer today. Enabling technologies being developed include: (1) new software tools for design, manufacture, and test; (2) flexible manufacturing equipment and processes; and (3) brokering systems and technology to facilitate electronic interchange of ASEM product specifications and design data. These technologies will be integrated at several prototypical ASEM foundries to provide cost-effective, low volume, quick turn-around access as well as high-volume production capability
Keywords :
application specific integrated circuits; integrated circuit manufacture; integrated circuit technology; integrated circuit testing; multichip modules; ASEM product specifications; ASEM program; MCM technology; application specific electronic module; brokering systems; commercial customers; cost-effective subsystem packaging; domestic supplier infrastructure; electronic interchange; flexible manufacturing equipment; merchant ASIC business; merchant MCM infrastructure; military customers; miniaturization; software tools; testing; Application specific integrated circuits; Business; Costs; Electronic equipment manufacture; Electronic equipment testing; Electronics packaging; Flexible manufacturing systems; Manufacturing processes; Software design; Software tools;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-3540-1
Type :
conf
DOI :
10.1109/MCMC.1993.302154
Filename :
302154
Link To Document :
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