Title :
Viking SuperSPARC AMCM development program
Author :
Eichelberger, Charles W. ; Davidson, Howard
Author_Institution :
ISA, Woburn, MA, USA
Abstract :
A program to develop a Viking SuperSparc AMCM is discussed. The program is structured not only to provide a prototype module, but also to resolve key infrastructure issues associated with volume production of the module. The AMCM technology was chosen to fabricate the module. This technology is a chips first approach and offers important advantages in thermal management, power delivery, size and system interface. The program is divided into four phases. The first phase completes the Viking AMCM design and layout. The second phase fabricates and tests first articles. The third place demonstrates bare chip test and burn-in. The final phase produces preproduction qualification samples
Keywords :
hybrid integrated circuits; integrated circuit testing; multichip modules; MCM technology; Viking SuperSparc AMCM; bare chip test; burn-in test; power delivery; system interface; thermal management; Capacitors; Connectors; Diodes; Electronics packaging; Instruction sets; Integrated circuit testing; Manufacturing; Production; Sun; Systolic arrays;
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-3540-1
DOI :
10.1109/MCMC.1993.302157
