Title :
Proceedings of IEEE Multi-Chip Module Conference (MCMC-93)
Abstract :
The following topics are dealt with: multichip module (MCM) technology; high-speed MCM systems; MCM infrastructure; testing and reliability; MCM interconnect modeling; MCM interconnect analysis; design for MCM; and physical design for MCM
Keywords :
circuit reliability; integrated circuit testing; multichip modules; MCM infrastructure; MCM interconnect modeling; design for MCM; high-speed MCM systems; interconnect analysis; multichip module technology; reliability; testing;
Conference_Titel :
Multi-Chip Module Conference, 1993. MCMC-93, Proceedings., 1993 IEEE
Conference_Location :
Santa Cruz, CA, USA
Print_ISBN :
0-8186-3540-1
DOI :
10.1109/MCMC.1993.302162
