Title :
Modeling of multi-vias coupling for high speed interconnects
Author :
Huang, Chung-Chi ; Tsang, Leung ; Miller, Dennis ; Tripathi, Alok
Author_Institution :
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
Abstract :
Modeling of multiple via coupling is an important problem in the design of high-speed interconnect systems. It is known that the inter-via coupling has non-negligible effects on the signal integrity of high-speed circuits. In this paper, we investigate first order multi-via coupling based on a two-coupled-vias model. Analytical results are compared with experimental data up to 5GHz. Transient waveforms were obtained for reflection and transmission for trapezoidal and Gaussian input
Keywords :
Gaussian distribution; circuit layout CAD; high-speed integrated circuits; integrated circuit interconnections; printed circuit layout; transient analysis; waveform analysis; 0 to 5 GHz; Gaussian input; high speed interconnects; high-speed circuits; inter-via coupling; multi-vias coupling; signal integrity; transient waveforms; trapezoidal input; two-coupled-vias model; Circuit synthesis; Coupling circuits; Electromagnetic scattering; Equations; Frequency; Integrated circuit interconnections; Joining processes; Reflection; Scattering parameters; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967636
