• DocumentCode
    1938124
  • Title

    Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes

  • Author

    Rong, Aosheng ; Cangellaris, Andreas C.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    225
  • Lastpage
    228
  • Abstract
    This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires
  • Keywords
    electromagnetic coupling; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; conductor surface; conductor volume; crossing wires; dielectric volume; electromagnetic coupling; generalized PEEC model; integrated passive; partial element equivalent circuit; three-dimensional interconnect; triangular cells; triangular prisms; Conductors; Current density; Dielectrics; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Integral equations; Integrated circuit interconnections; Polarization; Shape;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 2001
  • Conference_Location
    Cambridge, MA
  • Print_ISBN
    0-7803-7024-4
  • Type

    conf

  • DOI
    10.1109/EPEP.2001.967651
  • Filename
    967651