DocumentCode
1938124
Title
Generalized PEEC models for three-dimensional interconnect structures and integrated passives of arbitrary shapes
Author
Rong, Aosheng ; Cangellaris, Andreas C.
Author_Institution
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
fYear
2001
fDate
2001
Firstpage
225
Lastpage
228
Abstract
This paper presents the generalization of the Partial Element Equivalent Circuit method that facilitates its application to the modeling of structures of arbitrary shapes. This is achieved through the development of partial element equivalent circuit models using triangular cells and prisms as the fundamental building blocks for modeling conductor surfaces and conductor/dielectric volumes. The new Partial Element Equivalent Circuit models are demonstrated through their application to the quantification of electromagnetic coupling in crossing wires
Keywords
electromagnetic coupling; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; conductor surface; conductor volume; crossing wires; dielectric volume; electromagnetic coupling; generalized PEEC model; integrated passive; partial element equivalent circuit; three-dimensional interconnect; triangular cells; triangular prisms; Conductors; Current density; Dielectrics; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Integral equations; Integrated circuit interconnections; Polarization; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2001
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-7024-4
Type
conf
DOI
10.1109/EPEP.2001.967651
Filename
967651
Link To Document