DocumentCode
1938156
Title
Coupled electromagnetic-circuit simulation of arbitrarily-shaped conducting structures
Author
Wang, Yong ; Jandhyala, Vikram ; Shi, C. J Richard
Author_Institution
Dept. of Electr. Eng., Washington Univ., Seattle, WA, USA
fYear
2001
fDate
2001
Firstpage
233
Lastpage
236
Abstract
This paper presents a triangular surface mesh-based formulation of the Partial Element Equivalent Circuit (PEEC) approach. Rao-Wilton-Glisson (RWG) basis functions defined on triangular tessellations are used to model arbitrarily-shaped conducting structures via SPICE compatible netlists. This approach is potentially useful for modeling on-chip electromagnetic interactions
Keywords
SPICE; circuit simulation; conducting bodies; equivalent circuits; mesh generation; Rao-Wilton-Glisson basis functions; SPICE model; conducting structure; coupled electromagnetic-circuit simulation; on-chip electromagnetic interactions; partial element equivalent circuit; surface mesh; triangular tessellation; Conductors; Electromagnetic coupling; Electromagnetic modeling; Equivalent circuits; Impedance; Integrated circuit interconnections; SPICE; Sparse matrices; Surface resistance; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2001
Conference_Location
Cambridge, MA
Print_ISBN
0-7803-7024-4
Type
conf
DOI
10.1109/EPEP.2001.967653
Filename
967653
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