Title :
Modeling and measurement of the Alpha 21364 package
Author :
Tsuk, Michael ; Dame, Roger ; Dvorscak, Daniel ; Houghton, Chris ; Laurent, Jim St
Author_Institution :
Compaq Comput. Corp., Marlborough, MA, USA
Abstract :
The latest generation Alpha microprocessor, the 21364, uses a ceramic LGA package with mesh power and ground planes. Electromagnetic modeling and measurements were used to verify the validity of the design of the package, and to suggest improvements to the layout to minimize crosstalk
Keywords :
ceramic packaging; crosstalk; electromagnetic fields; integrated circuit layout; integrated circuit measurement; integrated circuit packaging; microprocessor chips; power supply circuits; Alpha 21364 microprocessor package; Alpha microprocessor; ceramic LGA package; crosstalk minimization; electromagnetic modeling; measurement; mesh ground planes; mesh power planes; modeling; package design validity verification; package layout; Capacitance; Crosstalk; Electromagnetic measurements; Electromagnetic modeling; Inductance; Mesh generation; Microprocessors; Packaging; Power generation; SPICE;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967664
