Title :
SI and design considerations for Gbps PCBs in communication systems
Author :
Mu, Zhen ; Willis, Ken
Author_Institution :
Sycamore Networks Inc., Chelmsford, MA, USA
Abstract :
This paper covers the board level signal integrity issues at Gbps rates, impact of pre-emphasis, interconnect design considerations, and plane configuration techniques for power delivery. Pre-defined rules can be drawn from the discussion to guide high speed board designs
Keywords :
high-speed techniques; interconnections; power supply circuits; printed circuit design; printed circuit testing; telecommunication equipment; PCBs; SI considerations; board level signal integrity; communication systems; design considerations; design pre-emphasis; high speed PCB design; high speed board designs; interconnect design; plane configuration techniques; power delivery; signal rates; Backplanes; Crosstalk; Dielectric losses; Dielectric materials; Frequency dependence; Geometry; Propagation losses; Reflection; Signal design; Skin effect;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967665
