• DocumentCode
    1938482
  • Title

    Design and implement of QPSK modem based on FPGA

  • Author

    Song, Wenmiao ; Yao, Qiongqiong

  • Author_Institution
    Dept. of Electron. & Commun. Eng., North China Electr. Power Univ., Baoding, China
  • Volume
    9
  • fYear
    2010
  • fDate
    9-11 July 2010
  • Firstpage
    599
  • Lastpage
    601
  • Abstract
    This paper presents a method to designs QPSK modulator and demodulator of a spread spectrum system, which use field programmable device. The method uses the tool of Quartus II of American Altera Co. The whole system is divided into several small models based on top-down design method, and using VHDL hardware description language to design each model. The direct digital synthesis (DDS) principle is briefly presented and used to design orthogonal cosine signal module. In demodulator, we use the low pass FIR filtering to filter high frequency component. The QPSK module is ultimately implemented on the FPGA device. The whole system has been simulated in the Quartus II7.2 simulation environment and successfully downloaded to the chip of the Cyclone II EP2C5F256C6. The operating results and the theoretical results are consistent, so it´s verified the correctness of this design. The results showed that the proposed method can greatly improve the developing efficiency, shorten developing period and reduce costs.
  • Keywords
    FIR filters; direct digital synthesis; field programmable gate arrays; hardware description languages; modems; quadrature phase shift keying; spread spectrum communication; FPGA; QPSK modem; QPSK modulator-demodulator; Quartus II; VHDL hardware description language; direct digital synthesis; field programmable device; low pass FIR filter; orthogonal cosine signal module; spread spectrum system; Demodulation; Field programmable gate arrays; Frequency modulation; Registers; DDS; FIR; QPSK; Quartus;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5537-9
  • Type

    conf

  • DOI
    10.1109/ICCSIT.2010.5564000
  • Filename
    5564000