Title :
Solution space analysis of interconnects for low voltage differential signaling (LVDS) applications
Author :
Ahn, Seungyoung ; Lu, Albert Chee W ; Fan, Wei ; Lai, L.W. ; Kim, Joungho
Author_Institution :
Electron. Packaging Group, Gintic Inst. of Manuf. Technol., Singapore, Singapore
Abstract :
This paper presents a solution space analysis of differential interconnects for low voltage differential signal (LVDS) applications. The interconnect performance has been evaluated using frequency-domain 3-D full-wave simulation, TDR measurement and time-domain transient simulation
Keywords :
frequency-domain analysis; integrated circuit interconnections; time-domain analysis; time-domain reflectometry; TDR measurement; differential interconnect; frequency-domain 3-D full-wave simulation; low voltage differential signaling; solution space analysis; time-domain transient simulation; Conducting materials; Conductors; Dielectrics; Impedance; Low voltage; Propagation constant; Scattering parameters; Signal analysis; Space technology; Submillimeter wave technology;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967674
