Title :
RF modeling of vertical interconnection between power-ground plane combined with 2D TLM
Author :
Ito, Ryosuke ; Carrillo-Ramirez, Rodrigo ; Jackson, Robert W.
Author_Institution :
Corporate Res. & Dev., M/A-COM Inc., Lowell, MA, USA
Abstract :
In this paper, we present a modeling technique for finding a lumped element model of a via interconnection that can be used in conjunction with a coarse grid two-dimensional transmission line matrix method (2D-TLM) analysis. The technique allows the use of very simple 2D TLM analysis to simultaneously compute insertion loss, return loss, and isolation of multiple via transitions through a power-ground plane pair in a multilayer package. The accuracy of this technique is validated by comparison to HFSS
Keywords :
interconnections; packaging; transmission line matrix methods; HFSS; RF model; insertion loss; isolation; lumped element model; multilayer package; multiple via transitions; power-ground plane; return loss; two-dimensional transmission line matrix; vertical interconnection; Feeds; Geometry; Impedance; Indium tin oxide; Insertion loss; Microwave frequencies; Nonhomogeneous media; Packaging; Radio frequency; Transmission line matrix methods;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2001
Conference_Location :
Cambridge, MA
Print_ISBN :
0-7803-7024-4
DOI :
10.1109/EPEP.2001.967677
