DocumentCode
19388
Title
Millimeter-Wave Small-Signal Model Using A Coplanar Waveguide De-Embedded Sub-Model for HEMT
Author
Tung The-Lam Nguyen ; Sam-Dong Kim
Author_Institution
Div. of Electron. & Electr. Eng., Dongguk Univ., Seoul, South Korea
Volume
24
Issue
2
fYear
2014
fDate
Feb. 2014
Firstpage
99
Lastpage
101
Abstract
We propose in this study an approach to highly reliable extraction method for parasitic elements of the 0.1 μm GaAs metamorphic high electron mobility transistors. This method utilizes the de-embedding scheme for the coplanar waveguide (CPW) feeding structure by considering the distributed extrinsic parasitic elements in our small-signal model. The parasitic extrinsic capacitances are determined by modeling a PI equivalent circuit including the interaction between the sub-model (the model after de-embedding) and the CPW feedings. Extractions for the parasitic elements are performed at four different gate widths ( 2×10 μm, 2×20 μm, 2×30 μm, and 2×70 μm), and our S-parameter prediction shows the best agreement with the measurements in a frequency range of 0.5-110 GHz (0.5 GHz step) among the small-signal models reported to date.
Keywords
III-V semiconductors; S-parameters; capacitance; coplanar waveguides; gallium arsenide; high electron mobility transistors; millimetre wave field effect transistors; semiconductor device models; GaAs; GaAs metamorphic high electron mobility transistors; HEMT; PI equivalent circuit; S-parameter prediction; coplanar waveguide de-embedded sub-model; coplanar waveguide feeding structure; de-embedding scheme; distributed extrinsic parasitic elements; frequency 0.5 GHz to 110 GHz; highly reliable extraction method; millimeter-wave small-signal model; parasitic extrinsic capacitances; size 0.1 mum; Coplanar waveguides; Equivalent circuits; Frequency measurement; Integrated circuit modeling; Logic gates; mHEMTs; Field effect transistors (FETs); linear and non-linear device modeling; microwave device characterization and measurements;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2013.2290214
Filename
6680704
Link To Document