Study on the application of thermal interface materials for integration of HP-LEDs

Author

Wu, Jun ; Zhuang, Meilin ; Li, Shuzhi ; Yang, Weiqiao ; Zhang, Jianhua

Author_Institution

Sch. of Mechatron. Eng. & Autom., Shanghai Univ., Shanghai, China

fYear

2010

fDate

24-26 Aug. 2010

Firstpage

1

Lastpage

5

Abstract

Contact thermal resistance existed in the contact face between light emitting diode (LED) substrate and heat sink, which could hinder thermal conducting from PN junction to heat sinks, when mounting high power LEDs (HP-LEDs) devices on the heat sinks. Thermal interface materials (TIMs) were filled in the contact face to reduce contact thermal resistance. This paper studied the application of TIMs used in cooling LEDs, and three types of TIMs were studied by thermal test and optical-electro test. The experiment results presented that when select TIMs for LED mounting, thermal conductivity, thickness, and the volume of fillers should be considered.

Keywords

heat sinks; light emitting diodes; thermal resistance; LED mounting; contact face; contact thermal resistance; cooling LED; heat sink; high power LED device; light emitting diode substrate; optical-electro test; thermal conductivity; thermal interface material; thermal test; Electronic packaging thermal management; Heat sinks; Light emitting diodes; Thermal conductivity; Thermal force; Thermal resistance; HP-LEDs; junction temperature; thermal dissipation; thermal interface materials; thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2010 IEEE

Conference_Location

Tokyo

Print_ISBN

978-1-4244-7593-3

Type

conf

DOI

10.1109/CPMTSYMPJ.2010.5680285

Filename

5680285