Title :
Data center energy conservation utilizing a heat pipe based ice storage system
Author :
Cabusao, Gerald ; Mochizuki, Masataka ; Mashiko, Koichi ; Kobayashi, Tetsuya ; Singh, Randeep ; Nguyen, Thang ; Wu, Xiao Ping
Author_Institution :
Fujikura Ltd., Tokyo, Japan
Abstract :
Data centers constantly expand and upgrade their capacity due to the ever-increasing demand for remote file storage. It is estimated that around 50% of the total data center power consumption is for cooling. With this trend, a reduction in the cooling power consumption would result in a substantial reduction in overall power consumption, as well as C02 emission. With the focus going towards renewable and natural sources of energy, a heat pipe based ice storage system is being proposed. This system is being considered as one good solution to reduce the power consumption, as well as CO2 emission of data centers. This Ice storage system is aimed at utilizing the low temperature of cold areas to form ice and cold water. The freezing index, which is the combined duration and magnitude of below freezing temperatures at a given freezing season, would be the criteria for choosing the data center location. The data center will be constructed in cold regions wherein the freezing index is 400°C-days and above. The thermosiphon, which acts as a thermal diode, can effectively cool down the water until ice is formed. This ice storage system can be integrated with the existing cooling system and can be utilized as an alternate cooling system or a back-up cooling system. The existing cooling system may be utilized during the warmer periods of the year. The actual ice storage system container, which is made of concrete, is to be constructed under ground, and integrated in parallel with the existing cooling system.
Keywords :
computer centres; cooling; energy conservation; heat exchangers; heat pipes; thermal resistance; data center energy conservation; heat pipe based ice storage system; thermal diode; thermosiphon; Cooling; Ice; Indexes; Power demand; Thermal resistance; Water heating;
Conference_Titel :
CPMT Symposium Japan, 2010 IEEE
Conference_Location :
Tokyo
Print_ISBN :
978-1-4244-7593-3
DOI :
10.1109/CPMTSYMPJ.2010.5680287