DocumentCode
1940419
Title
Spray cooling of power electronics using high temperature coolant and enhanced surface
Author
Bostanci, Huseyin ; Van Ee, David ; Saarloos, Benjamin A. ; Rini, Daniel P. ; Chow, Louis C.
Author_Institution
RINI Technol., Inc., Oviedo, FL, USA
fYear
2009
fDate
7-10 Sept. 2009
Firstpage
609
Lastpage
613
Abstract
A spray cooling system was developed and tested for thermal management of power inverter modules utilized in automotive applications. System featured an array of 1 times 2 pressure atomized nozzles that used 90degC antifreeze coolant with 0.15 L/min-cm2 liquid flow rate and 145 kPa pressure drop. Two cm2 simulated device, having an enhanced spray surface with micro scale structures, reached up to 400 W/cm2 heat flux with only 14degC surface superheat. These experimental results demonstrated the capability of greatly reducing the overall thermal resistance of the inverter modules that are commonly cooled with single phase convective systems. Performance of the presented system proved the spray cooling of power electronics as an attractive option that enables high power densities while maintaining satisfactory and uniform device temperatures. In addition, due to the use of high temperature coolant at low flow rates, spray cooling offers compact and efficient system design.
Keywords
automotive electronics; coolants; cooling; insulated gate bipolar transistors; invertors; power electronics; thermal management (packaging); IGBT; antifreeze coolant; high temperature coolant; hybrid vehicle; power electronics; power inverter modules; pressure atomized nozzles; single phase convective systems; spray cooling; thermal management; Coolants; Electronics cooling; Inverters; Power electronics; Surface resistance; System testing; Temperature; Thermal management of electronics; Thermal resistance; Thermal spraying; IGBT; hybrid vehicle; power electronics; spray cooling; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Vehicle Power and Propulsion Conference, 2009. VPPC '09. IEEE
Conference_Location
Dearborn, MI
Print_ISBN
978-1-4244-2600-3
Electronic_ISBN
978-1-4244-2601-0
Type
conf
DOI
10.1109/VPPC.2009.5289793
Filename
5289793
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