An extended de-embedding method for on-wafer components

Author

Lin, Yu-ling ; Yen, Hsiao-Tsung ; Chen, Ho-Hsiang ; Jou, Chewn-Pu ; Kuo, Chin-Wei ; Jeng, Min-Che ; Hsuch, Fu-Lung ; Hsiao, Chih-Hua ; Huang, Guo-Wei

Author_Institution

Taiwan Semicond. Manuf. Co. Ltd., Hsinchu, Taiwan

fYear

2012

fDate

19-22 March 2012

Firstpage

166

Lastpage

168

Abstract

On-wafer de-embedding method has been proposed for different method up to millimeter-wave (mm-wave) frequency range. An extended de-embedding method for on wafer devices up to 65 GHz is proposed. Using Vertical connection of L-2L (VL2L) is presented in this paper, with a calibrated loss tangent value in mm-wave. It shows significant good and accurate results for on-wafer modeling up to 65 GHz. VL2L are considered to be a good method for different kind of devices, such as capacitors. Also, the results by different CMOS process and EM simulation are with good agreement.

Keywords

CMOS integrated circuits; calibration; circuit simulation; field effect MIMIC; integrated circuit interconnections; CMOS process; EM simulation; VL2L; calibrated loss tangent value; extended deembedding method; millimeter wave device; on-wafer components; on-wafer devices; on-wafer modeling; vertical connection of L-2L; CMOS millimeter wave integrated circuit; Calibration; L-2L de-embedding; Scattering parameters measurement; on-wafer microwave measurement; passive components;

fLanguage

English

Publisher

ieee

Conference_Titel

Microelectronic Test Structures (ICMTS), 2012 IEEE International Conference on

Conference_Location

San Diego, CA

ISSN

1071-9032

Print_ISBN

978-1-4673-1027-7

Type

conf

DOI

10.1109/ICMTS.2012.6190638

Filename

6190638