DocumentCode
1942169
Title
Integration of a planar inverted F antenna on a cavity-down ceramic ball grid array package
Author
Zhang, Y.P. ; Li, W.B.
Author_Institution
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Volume
4
fYear
2002
fDate
2002
Firstpage
520
Abstract
This paper presents the integration of an antenna in a chip package for the single-chip solutions of wireless transceivers in CMOS. The antenna that takes the basic form of a planar inverted F is integrated on a thin 15 mm ×15 mm cavity-down ceramic ball grid array package. The planar patch size is 10.8 mm × 9.9 mm. The prototype antenna has achieved an impedance bandwidth of 4.12% and a gain of -9 dBi at 2.43 GHz.
Keywords
CMOS integrated circuits; UHF antennas; UHF integrated circuits; antenna radiation patterns; ball grid arrays; ceramic packaging; electric impedance; microstrip antennas; transceivers; 10.8 mm; 15 mm; 2.43 GHz; 9.9 mm; CMOS; antenna gain; ceramic ball grid array; chip package; far-field radiation patterns; impedance bandwidth; microstrip antenna; planar inverted F antenna; wireless transceivers; Bandwidth; Bonding; Ceramics; Dielectric resonator antennas; Dipole antennas; Electronics packaging; Geometry; Impedance; Integrated circuit packaging; Transceivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2002. IEEE
Print_ISBN
0-7803-7330-8
Type
conf
DOI
10.1109/APS.2002.1017035
Filename
1017035
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