The use of III-V ICs in WDM optical network equipment

Author

Sitch, J. ; Dreze, C. ; Pollex, D. ; Warbrick, K. ; Lowe, K. ; Best, E. ; Wilson, T. ; Corr, P. ; Weston, G.

Author_Institution

BNR, Ottawa, Ont., Canada

fYear

1995

fDate

Oct. 29 1995-Nov. 1 1995

Firstpage

177

Lastpage

180

Abstract

WDM is not about to replace all other fiber systems overnight, but it will add to network functionality and enable many new services. In order to pay for the optical components, WDM systems have to be high capacity. The technologies needed to make integrated WDM network equipment are presently emerging. III-V ICs offer speed and power performance that currently lead the field, although silicon ICs are very close in many areas. III-Vs are the only way to make OEICs, and are a contender for some integrated optics functions. Packaging is the area where the largest gains can be made.

Keywords

III-V semiconductors; digital communication; integrated circuit packaging; integrated optoelectronics; modules; monolithic integrated circuits; optical communication equipment; optical fibre networks; wavelength division multiplexing; III-V ICs; OEIC; WDM optical network equipment; fiber systems; high speed operation; integrated optics functions; packaging; III-V semiconductor materials; Intelligent networks; Optical fiber devices; Optical fiber networks; Optical network units; Optical receivers; Optical transmitters; Stimulated emission; WDM networks; Wavelength division multiplexing;

fLanguage

English

Publisher

ieee

Conference_Titel

Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1995. Technical Digest 1995., 17th Annual IEEE

Conference_Location

San Diego, CA, USA

Print_ISBN

0-7803-2966-X

Type

conf

DOI

10.1109/GAAS.1995.528988

Filename

528988