• DocumentCode
    1942278
  • Title

    Applications of life cycle assessment in the electronics industry for product design and marketing claims

  • Author

    Rhodes, Stanley P.

  • Author_Institution
    Scientific Certification Systems, Inc., Oakland, CA, USA
  • fYear
    1993
  • fDate
    10-12 May 1993
  • Firstpage
    101
  • Lastpage
    105
  • Abstract
    The author describes the LCA (life cycle assessment) process in detail, and discusses some of the important applications of LCA internationally in the electronics and power products industry. LCA provides a timely analytical framework and methodology for conducting systems analyses to determine the most productive, least costly steps for improvement. LCA involves the cradle-to-grave examination of a product, from raw material extraction and manufacturing through distribution, use, and final disposal. This methodology is used to quantify and calculate the resources and energy used, and emissions and wastes generated, by the system. Internationally, LCA has gained recognition as the most comprehensive methodology of its kind for assessing environmental burdens. LCA studies are proving extremely useful to companies seeking to optimize product and packaging design decisions from an environmental perspective. In addition, an increasing number of companies are discovering the potential market value of presenting the findings of such studies to the public
  • Keywords
    design engineering; electronic equipment manufacture; environmental engineering; packaging; LCA; electronics industry; environmental perspective; life cycle assessment; manufacturing; marketing; packaging design; power products industry; product design; raw material extraction; waste generation; Consumer electronics; Design optimization; Electronics industry; ISO standards; Industrial electronics; Lead; Manufacturing; Product design; Production; Raw materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 1993., Proceedings of the 1993 IEEE International Symposium on
  • Conference_Location
    Arlington, VA
  • Print_ISBN
    0-7803-0829-8
  • Type

    conf

  • DOI
    10.1109/ISEE.1993.302828
  • Filename
    302828