DocumentCode
1942553
Title
Device Design of a High Voltage BiCMOS IC
Author
Qin-Yi, Tong ; Wei, Wu
Author_Institution
Microelectronics Center, Nanjing Institute of Technology, Nanjing 210018, China
fYear
1987
fDate
14-17 Sept. 1987
Firstpage
1059
Lastpage
1062
Abstract
A new high voltage (H. V) npn bipolar transistor for H. V BiCMOS IC´s has been developed which is fully compatible with conventional low valtage n-well CMOS process. The npn transistor employs n-well of low valtage (L.V) CMOS as the collector drift region and it acts as the self-isolation region as well. The narrow self-aligned base is a result of double diffusion. The device has shown a high performene, i.e, hFE of 100, fT of 31 MHz and BVceo of greater than 300 V. It is expected that complaentary H. V npn and pnp transistors of this type can be integrated with H.V and L. V CMOS and bipolar devices on a same chip by Silicon wafer Direct Bonding (SDB)/ SOT technology.
Keywords
BiCMOS integrated circuits; Bipolar integrated circuits; Bipolar transistors; CMOS integrated circuits; CMOS process; CMOS technology; Iron; Silicon; Voltage; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
Conference_Location
Bologna, Italy
Print_ISBN
0444704779
Type
conf
Filename
5436812
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