• DocumentCode
    1942705
  • Title

    Phase transformation of metallic nanoparticle deposits for the electrodes of flexible electronics

  • Author

    Kao, Tzu-Hsuan ; Song, Jenn-Ming ; Wang, Jian-Yih ; Chen, In-Gann

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2010
  • fDate
    24-26 Aug. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Suspensions with metallic nanoparticles have been widely used to fabricate conductive lines and electrodes for flexible electronic devices under a relatively low processing temperature. This study prepared thiol-stabilized Au nanoparticle suspension and investigated phase transformation of the Au nanoparticle deposits (NPDs) upon heating via in-situ synchrotron radiation X-ray diffraction. With an increasing temperature, the broad diffraction peak of nanosized Au particles with the average diameter of 3nm can be suppressed at around 200°C and soon becomes sharp due to melting and the following solidification. When deposited on the commonly-used electronic substrate, Cu, liquid-solid reaction might occur between the NPDs and the substrate during the thermal process. The low temperature alloying behavior and the formation of the Cu3Au superlattices were manifested by SIMS, XPS and GIXRD.
  • Keywords
    X-ray diffraction; X-ray photoelectron spectra; copper alloys; electrodes; flexible electronics; gold; gold alloys; melting; metallic superlattices; metallisation; nanoparticles; secondary ion mass spectra; solidification; suspensions; Au; Cu3Au; GIXRD; SIMS; XPS; conductive lines; electronic substrate; flexible electronic electrode; melting; metallic nanoparticle deposits; phase transformation; solidification; superlattice formation; thiol stabilized gold nanoparticle suspension; Copper; Curing; Films; Gold; Heating; Substrates; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    CPMT Symposium Japan, 2010 IEEE
  • Conference_Location
    Tokyo
  • Print_ISBN
    978-1-4244-7593-3
  • Type

    conf

  • DOI
    10.1109/CPMTSYMPJ.2010.5680473
  • Filename
    5680473