DocumentCode :
1943504
Title :
Plasma processing
Author :
Graves, D.B.
Author_Institution :
Dept. of Chem. Eng., California Univ., Berkeley, CA, USA
fYear :
1993
fDate :
7-9 June 1993
Firstpage :
185
Abstract :
Summary form only given. The author discusses gas discharge plasmas and the development of plasmas as a key technology in materials processing. The focus is on the use of plasmas in electronic materials processing, especially etching of thin films. The author considers the range of problems that need to be addressed in this technology, with an emphasis on the role that plasma science can play in attacking problems that remain unresolved. An example of a problem faced by plasma process and design engineers is the rapid pace of process and plasma tool development, driven by short product development and cycle times in the industry. The author also presents some results from his own research group in the area of direct atomistic simulations of reactive plasma-surface interactions.
Keywords :
plasma applications; cycle times; design engineers; direct atomistic simulations; electronic materials processing; etching; gas discharge plasmas; materials processing; plasma science; plasma tool; plasmas; product development; reactive plasma-surface interactions; thin films; Design engineering; Discharges; Etching; Materials science and technology; Nuclear and plasma sciences; Plasma applications; Plasma materials processing; Plasma simulation; Process design; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Plasma Science, 1993. IEEE Conference Record - Abstracts., 1993 IEEE International Conference on
Conference_Location :
Vancouver, BC, Canada
ISSN :
0730-9244
Print_ISBN :
0-7803-1360-7
Type :
conf
DOI :
10.1109/PLASMA.1993.593511
Filename :
593511
Link To Document :
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