A Fast Void Detection Algorithm for Three-Dimensional Deposition Simulation

We present an efficient algorithm for the detection of voids which potentially emerge during deposition process simulation. The application of modern level set techniques and data structures enables the fast determination of connected components directly from the implicit level set representation without the need of an additional surface extraction. The algorithm exhibits optimal linear scaling with surface size and is demonstrated on an example, where an isotropic etching process followed by conformal deposition is simulated.