DocumentCode :
1944112
Title :
Compact and Efficient Monte Carlo Method to Reproduce Size Effect on Resistivity in Sub-0.1μm Metallic Interconnects
Author :
Kurusu, Takashi ; Wada, Makoto ; Matsunaga, Noriaki ; Tanimoto, Hiroyoshi ; Aoki, Nobutoshi ; Toyoshima, Yoshiaki ; Shibata, Hideki
Author_Institution :
Center for Semicond. R&D, Toshiba Corp., Yokohama, Japan
fYear :
2009
fDate :
9-11 Sept. 2009
Firstpage :
1
Lastpage :
4
Abstract :
We present a compact and efficient Monte Carlo method to reproduce a size effect on resistivity in sub-0.1 mum metallic interconnects. Implementation of our method is easy and our method is also not CPU-intensive thanks to its compactness and simplicity. In our method, the geometric effect of the size effect can be taken into account since surface scattering and grain boundary scattering, which are causes of the size effect on resistivity, are treated as real space interaction. We found that in rectangular metallic wires, mean free path of electrons around the corners of wires decreases owing to multiple surface scatterings and drift velocity around the corners is degraded. In very narrow and thin wires, this velocity degradation due to multiple surface scatterings is dominant and enhances the size effect of resistivity.
Keywords :
Monte Carlo methods; carrier mean free path; electrical resistivity; grain boundaries; integrated circuit interconnections; size effect; Monte Carlo method; drift velocity; electrical resistivity; geometric effect; grain boundary scattering; mean free path; metallic interconnects; rectangular metallic wires; size effect; surface scattering; Conductivity; Copper; Degradation; Electrons; Grain boundaries; Rough surfaces; Scattering; Solid modeling; Surface treatment; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
Conference_Location :
San Diego, CA
ISSN :
1946-1569
Print_ISBN :
978-1-4244-3974-8
Electronic_ISBN :
1946-1569
Type :
conf
DOI :
10.1109/SISPAD.2009.5290224
Filename :
5290224
Link To Document :
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