• DocumentCode
    1944112
  • Title

    Compact and Efficient Monte Carlo Method to Reproduce Size Effect on Resistivity in Sub-0.1μm Metallic Interconnects

  • Author

    Kurusu, Takashi ; Wada, Makoto ; Matsunaga, Noriaki ; Tanimoto, Hiroyoshi ; Aoki, Nobutoshi ; Toyoshima, Yoshiaki ; Shibata, Hideki

  • Author_Institution
    Center for Semicond. R&D, Toshiba Corp., Yokohama, Japan
  • fYear
    2009
  • fDate
    9-11 Sept. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We present a compact and efficient Monte Carlo method to reproduce a size effect on resistivity in sub-0.1 mum metallic interconnects. Implementation of our method is easy and our method is also not CPU-intensive thanks to its compactness and simplicity. In our method, the geometric effect of the size effect can be taken into account since surface scattering and grain boundary scattering, which are causes of the size effect on resistivity, are treated as real space interaction. We found that in rectangular metallic wires, mean free path of electrons around the corners of wires decreases owing to multiple surface scatterings and drift velocity around the corners is degraded. In very narrow and thin wires, this velocity degradation due to multiple surface scatterings is dominant and enhances the size effect of resistivity.
  • Keywords
    Monte Carlo methods; carrier mean free path; electrical resistivity; grain boundaries; integrated circuit interconnections; size effect; Monte Carlo method; drift velocity; electrical resistivity; geometric effect; grain boundary scattering; mean free path; metallic interconnects; rectangular metallic wires; size effect; surface scattering; Conductivity; Copper; Degradation; Electrons; Grain boundaries; Rough surfaces; Scattering; Solid modeling; Surface treatment; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 2009. SISPAD '09. International Conference on
  • Conference_Location
    San Diego, CA
  • ISSN
    1946-1569
  • Print_ISBN
    978-1-4244-3974-8
  • Electronic_ISBN
    1946-1569
  • Type

    conf

  • DOI
    10.1109/SISPAD.2009.5290224
  • Filename
    5290224