Title :
Scaling effects on grain size and texture of lead free interconnects — investigations by electron backscatter diffraction and nanoindentation
Author :
Krause, M. ; Müller, M. ; Petzold, M. ; Wiese, S. ; Wolter, K.-J.
Author_Institution :
Fraunhofer Inst. for Mech. of Mater., Halle
Abstract :
In this paper, the application of electron backscatter diffraction (EBSD) methods to solder interconnects is demonstrated, with particular emphasis on the effect of solder material volume on grain orientation, grain size and grain distribution in SnAg3.0Cu0.5 material, as well as with respect to the analysis of intermetallic compounds (IMC) formed in solder to board metallization interfaces. Investigations were carried out on solder spheres and solder interconnects between Cu/Sn or NiAu metallizations. It is shown, that the EBSD results derived allow to study the correlation between mechanical deformation properties, e.g. as characterized by nanoindentation testing, and microstructure in solder material in more detail which is of considerable significance for future improved reliability investigations.
Keywords :
copper alloys; deformation; electron backscattering; electron diffraction; grain size; indentation; interconnections; metallisation; silver alloys; solders; texture; tin alloys; SnAgCu; deformation; electron backscatter diffraction; grain distribution; grain orientation; grain size; intermetallic compounds; metallization interfaces; microstructure; nanoindentation testing; reliability; solder interconnects; texture; Backscatter; Diffraction; Electrons; Environmentally friendly manufacturing techniques; Grain size; Inorganic materials; Intermetallic; Lead; Metallization; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2008. ECTC 2008. 58th
Conference_Location :
Lake Buena Vista, FL
Print_ISBN :
978-1-4244-2230-2
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2008.4549953
