DocumentCode :
1944852
Title :
The Influence of X-ray Damage on Electron-Induced Interface Degradation in MOS Capacitors
Author :
Schwalke, U. ; Jacobs, E.P. ; Breithaupt, B.
Author_Institution :
Siemens AG, Corporate Research and Development, Microelectronics, D-8000 Mÿnchen 83, F.R.G.
fYear :
1988
fDate :
13-16 Sept. 1988
Abstract :
The radiation response of MOS capacitors and their degradation resistance after annealing has been investigated. Compared to unexposed samples, irradiated and subsequently annealed MOS capacitors were found to be more prone to electron-induced interface degradation. The enhanced degradation correlates with the initial radiation damage and is lowest in TaSi2 silicide gates. To which extent hydrogen contamination of the oxide or mechanical strain may account for the observed results will be discussed.
Keywords :
Annealing; Capacitive sensors; Contamination; Degradation; Electrodes; Etching; Hydrogen; MOS capacitors; Silicides; X-ray lithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1988. ESSDERC '88. 18th European
Conference_Location :
Montpellier, France
Print_ISBN :
2868830994
Type :
conf
Filename :
5436920
Link To Document :
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