DocumentCode
1944852
Title
The Influence of X-ray Damage on Electron-Induced Interface Degradation in MOS Capacitors
Author
Schwalke, U. ; Jacobs, E.P. ; Breithaupt, B.
Author_Institution
Siemens AG, Corporate Research and Development, Microelectronics, D-8000 Mÿnchen 83, F.R.G.
fYear
1988
fDate
13-16 Sept. 1988
Abstract
The radiation response of MOS capacitors and their degradation resistance after annealing has been investigated. Compared to unexposed samples, irradiated and subsequently annealed MOS capacitors were found to be more prone to electron-induced interface degradation. The enhanced degradation correlates with the initial radiation damage and is lowest in TaSi2 silicide gates. To which extent hydrogen contamination of the oxide or mechanical strain may account for the observed results will be discussed.
Keywords
Annealing; Capacitive sensors; Contamination; Degradation; Electrodes; Etching; Hydrogen; MOS capacitors; Silicides; X-ray lithography;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1988. ESSDERC '88. 18th European
Conference_Location
Montpellier, France
Print_ISBN
2868830994
Type
conf
Filename
5436920
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